Force sensing module and method of manufacturing the same and electronic device
US11216143B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2020 |
| Grant date | Jan 4, 2022 |
| Priority date | — |
| Expiry date | Sep 11, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04105
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A force sensing module includes a first transparent electrode, a second transparent electrode, and a light-transmitting force-sensitive composite layer. The light-transmitting force-sensitive composite layer includes at least one light-transmitting electrode layer and at least one functional spacer layer. The light-transmitting electrode layer has a first resistivity. The functional spacer layer has a second resistivity greater than the first resistivity. The light-transmitting electrode layer and the functional spacer layer are stacked between the first transparent electrode and the second transparent electrode. The light-transmitting force-sensitive composite layer has an optical transmittance greater than 85% and a haze less than 3%.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.