Patent · US Active

Multi-die and multi-core computing platform and booting method therefor

US11216284B2 · kind B2 · utility

2Cited by

0References

20Claims

0Family size

Assignee

SHANGHAI ZHAOXIN SEMICONDUCTOR CO., LTD. · CN

Inventors

Jinglong Liu · Beijing, CN
Qunchao FENG · Beijing, CN
Yankui Niu · Beijing, CN
Yongfeng Song · Beijing, CN
Jintao Wang · 东风镇, CN
Jiangbo Wang · Beijing, CN

Key dates

Filing date	Sep 29, 2020
Grant date	Jan 4, 2022
Priority date	—
Expiry date	Sep 29, 2040

Classification

Technology area (CPC G)Physics
CPC primaryG06F2213/0002
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A multi-die and multi-core computing platform in which multiple dies share the same storage device for firmware code storage is shown. After a slave die loads #1 firmware code from the storage device through a bus, the right to use the bus is released by the slave die and the slave die outputs a #0 enable signal to a master die. According to the #0 enable signal, the master die gains the right to use the bus. Through the bus, the master die loads #0 firmware code from the storage device. The slave die executes the #1 firmware code and the master die executes the #0 firmware code to initialize a link between the master and slave dies.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.