Dual-sided co-packaged optics for high bandwidth networking applications

US11217573B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Suresh Pothukuchi · Chandler, US
• Andrew C. Alduino · Santa Clara, US
• Ravindranath V. Mahajan · Chandler, US
• Srikant Nekkanty · Chandler, US
• Ling Liao · Santa Clara, US
• Harinadh POTLURI · Milpitas, US
• David M. Bond · Epsom, US
• Sushrutha Gujjula · Chandler, US
• Donald T. Tran · Phoenix, US
• David Chak Wang Hui · Santa Clara, US
• Vladimir Tamarkin · Huntingdon Valley, US

Key dates

• Filing date: Mar 4, 2020
• Grant date: Jan 4, 2022
• Expiry date: Mar 4, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H04Q2011/0039
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.