Connecting a flexible circuit to other structures
US11219124B2 · kind B2 · utility
0Cited by
10References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2019 |
| Grant date | Jan 4, 2022 |
| Priority date | — |
| Expiry date | May 23, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0776
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
One example provides a circuit structure comprising a liquid metal conductive path enclosed in an encapsulant, a polymer circuit support comprising a polymer having a functional species available for a condensation reaction, and a cross-linking agent covalently bonding the encapsulant to the polymer circuit support via the functional species.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.