Method and processing machine for piercing, drilling or cutting metal workpieces

US11219965B2 · kind B2 · utility

Assignee

• TRUMPF Werkzeugmaschinen GmbH + Co. KG · DE

Inventors

• Martin Spiess · Gerlingen, DE
• Markus Blaschka · Schenefeld, DE

Key dates

• Filing date: Dec 21, 2017
• Grant date: Jan 11, 2022
• Expiry date: Aug 19, 2040

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B23K2101/18
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

The disclosure relates to methods and systems for piercing, drilling, or cutting metal workpieces in a laser processing operation. The methods include focusing a pulsed laser beam onto a processing location on a workpiece; detecting process radiation emitted from the processing location; determining an intensity of the process radiation at a plurality of temporally sequential times during pulse pauses; determining an intensity gradient of the process radiation; comparing the intensity gradient with a gradient threshold value; and detecting a spontaneous material removal on the workpiece when the number of times the gradient threshold value has been exceeded is above a predetermined limit value. When a spontaneous material removal is detected, the system changes one or both of a laser parameter and a processing parameter of the laser processing operation. The disclosure also relates to processing machines for carrying out the methods.