Patent · US Active

Laser processing head with two nozzles and systems and methods therefor

US11219968B2 · kind B2 · utility

0Cited by

3References

17Claims

0Family size

Assignee

NINGBO INSTITUTE OF MATERIALS TECHNOLOGY & ENGINEERING, CHINESE ACADEMY OF SCIENCES · CN

Inventors

Wenwu Zhang · Schenectady, US
Tianrun Zhang · Missouri City, US
Chunhai GUO · Zhejiang, CN
Yang Yang · Hangzhou City, CN

Key dates

Filing date	Sep 30, 2015
Grant date	Jan 11, 2022
Priority date	—
Expiry date	May 24, 2038

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K26/389
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A laser processing head (100) comprises a first-level nozzle (110) and a second-level nozzle (120) that communicate with each other, wherein the second-level nozzle (120) is arranged downstream of the first-level nozzle (110); an inner diameter of the second-level nozzle (120) gradually decreases in a laser transmission direction, and minimum inner diameter of the first-level nozzle (110) is larger than the inner diameter of a tail end of the second-level nozzle (120). The laser processing head (100) solves the contradiction between high energy density laser and the system reliability through gradual coupling. Also provided are a laser processing system and a laser processing method.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.