Patent · US Active

Molding system and methods for forming structures

US11220072B2 · kind B2 · utility

0Cited by
2References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 2, 2020
Grant dateJan 11, 2022
Priority date
Expiry dateJan 6, 2040

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB29K2105/0872
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A molding system and methods of forming a structure are presented. A molding system is configured to form a composite structure. The molding system comprises a first tool comprising a first vacuum groove, a first trough having a first edge configured to form a first bend of the composite structure, and a first molding surface; and a second tool comprising a second vacuum groove, a second trough having a second edge configured to form a second bend of the composite structure, and a second molding surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.