Molding system and methods for forming structures
US11220072B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 2, 2020 |
| Grant date | Jan 11, 2022 |
| Priority date | — |
| Expiry date | Jan 6, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2105/0872
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A molding system and methods of forming a structure are presented. A molding system is configured to form a composite structure. The molding system comprises a first tool comprising a first vacuum groove, a first trough having a first edge configured to form a first bend of the composite structure, and a first molding surface; and a second tool comprising a second vacuum groove, a second trough having a second edge configured to form a second bend of the composite structure, and a second molding surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.