Bond fixture for composite splice cap assembly
US11220331B2 · kind B2 · utility
0Cited by
8References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2019 |
| Grant date | Jan 11, 2022 |
| Priority date | — |
| Expiry date | Nov 29, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C73/24
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
A bond fixture for bonding a component includes a frame defining a chamber for receiving the component. A first pad and a second pad are mounted to the frame. At least one of the first pad and the second pad is movable relative to the frame to adjust a pressure applied to the component. A caul assembly is adapted to be disposed in thermal communication with the component. The caul assembly heats a localized portion of the component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.