Reduced MEMS cavity gap
US11220423B2 · kind B2 · utility
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3References
14Claims
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Assignee
Inventors
Key dates
| Filing date | May 9, 2019 |
| Grant date | Jan 11, 2022 |
| Priority date | — |
| Expiry date | May 9, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/036
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Provided herein is a method including forming a MEMS cap. A cavity is formed in the MEMS cap wafer, and a bond material is deposited on the MEMS cap wafer, wherein the bond material lines the cavity after the depositing. The MEMS cap wafer is bonded to a MEMS device wafer, wherein the bond material forms a bond between the MEMS cap wafer and the MEMS device wafer. A MEMS device is formed in the MEMS device wafer. The bond material is removed from the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.