Low dust additives comprising emulsified powder for joint compounds and joint compounds thereof
US11220615B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 29, 2019 |
| Grant date | Jan 11, 2022 |
| Priority date | — |
| Expiry date | Jul 29, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/035
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention relates generally to wall repair compounds such as joint compounds, spackling compounds, and the like used to repair imperfections in walls or fill joints between adjacent wallboard panels. Particularly, the present invention relates to such a wall repair compound comprising a dust reduction additive that reduces the quantity of airborne dust generated when the hardened compound is sanded and also exhibits improved adhesive properties. The dust reduction additive also imparts adhesion to the wall repair compounds to which it is added, for example to a joint compound. The dust reduction additive is a powder prepared from colloidally-protected, wax-based microstructure dispersions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.