Roll bond plate evaporator structure
US11221162B2 · kind B2 · utility
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2References
1Claims
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Assignee
Inventors
Key dates
| Filing date | May 27, 2019 |
| Grant date | Jan 11, 2022 |
| Priority date | — |
| Expiry date | Jun 20, 2039 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25D23/061
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A roll bond plate evaporator structure is disclosed. The roll bond plate evaporator structure includes a heat dissipation member, at least one inlet and at least one outlet. The heat dissipation member is composed of a first plate body and a second plate body, which are correspondingly mated with each other. The first and second plate bodies together define a flow way. A working fluid is filled in the flow way. The inlet is formed at one end of the heat dissipation member in communication with the flow way and the outlet is formed at the other end of the heat dissipation member in communication with the flow way.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.