Optical interconnect assemblies and associated systems for large-scale spine and leaf topologies
US11221454B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 8, 2020 |
| Grant date | Jan 11, 2022 |
| Priority date | — |
| Expiry date | May 8, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/3885
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An optical interconnect module comprises a housing including a front-facing portion that includes a first face and a second face, wherein the first face of the front-facing portion is angled relative to the second face of the front-facing portion. The housing also includes a rear-facing portion opposing the front facing portion, the rear-facing portion including a first face and a second face, wherein the first face of the rear-facing portion is angled relative to the second face of the rear-facing portion. The housing further includes an internal chamber disposed between the front-facing portion and the rear-facing portion. A first plurality of multifiber connectors is disposed on the front-facing portion of the housing, and a first plurality of multifiber connectors disposed on the rear-facing portion of the housing. Each connector of the first plurality of multifiber connectors disposed on the front-facing portion is optically connected to each connector of the first plurality of multifiber connectors disposed on the rear-facing portion by at least a pair of optical fibers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.