Printed wiring board and method for manufacturing printed wiring board
US11222791B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 14, 2020 |
| Grant date | Jan 11, 2022 |
| Priority date | — |
| Expiry date | May 14, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10159
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A printed wiring board includes a resin insulating layer, a metal post formed in the resin insulating layer such that the metal post is protruding from a first surface of the resin insulating layer, a conductor layer formed on a second surface of the resin insulating layer on the opposite side with respect to the first surface of the resin insulating layer, and a via conductor formed in the resin insulating layer such that the via conductor is penetrating through the resin insulating layer and connecting the metal post and the conductor layer. The metal post has a protruding portion protruding from the first surface of the resin insulating layer and an embedded portion integrally formed with the protruding portion and embedded in the resin insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.