Multiple semiconductor die container load port
US11222802B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2020 |
| Grant date | Jan 11, 2022 |
| Priority date | — |
| Expiry date | Jul 8, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/04
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.