Patent · US Active

Package with electrical pathway

US11222834B2 · kind B2 · utility

0Cited by

16References

20Claims

0Family size

Assignee

Analog Devices International Unlimited Company · IE

Inventors

Jonathan Kraft · Frederick, US
David Aherne · Limerick, IE

Key dates

Filing date	Jan 22, 2020
Grant date	Jan 11, 2022
Priority date	—
Expiry date	Feb 5, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2225/06575
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A package with a laminate substrate is disclosed. The laminate substrate includes a first layer with a first terminal and a second terminal. The laminate substrate also includes a second layer with a conductive element. The laminate substrate further includes a first via and a second via that electrically connect the first terminal to the conductive element and the second terminal to the conductive element, respectively. The package can include a die mounted on and electrically connected to the laminate substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.