Device comprising leadframes, and method for producing a plurality of devices
US11222999B2 · kind B2 · utility
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0References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2018 |
| Grant date | Jan 11, 2022 |
| Priority date | — |
| Expiry date | Sep 21, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/853
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device with a lead frame, a moulded body and a plurality of semiconductor chips configured to generate radiation is specified, wherein Furthermore, a method for producing devices is specified.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.