Modulated thermal conductance thermal enclosure
US11223054B2 · kind B2 · utility
0Cited by
7References
5Claims
0Family size
Assignee
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Key dates
| Filing date | Feb 4, 2020 |
| Grant date | Jan 11, 2022 |
| Priority date | — |
| Expiry date | Jul 3, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A thermal insulation device includes a first plate, a second plate formed to nest adjacent the first plate with a gap between the first and second plates, a porous material disposed in the gap between the plates, a sealing layer disposed between the first and second plates such that the porous material is sealed from ambient at a pressure less than ambient, and a vapor generating material disposed in the gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.