Microphone structure
US11223908B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2020 |
| Grant date | Jan 11, 2022 |
| Priority date | — |
| Expiry date | Sep 7, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A microphone structure includes a backplate, a diaphragm, a sidewall and at least one airflow retaining wall. The backplate has a plurality of through holes. The diaphragm has at least one slot. The sidewall is located between the backplate and the diaphragm such that the sidewall, the diaphragm and the backplate collectively define a chamber. The at least one airflow retaining wall protrudes from the backplate and is located within the chamber. The airflow retaining wall is positioned between the through holes and the slot, and has an uneven width.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.