Skin-foam-substrate structure via induction heating
US11225047B2 · kind B2 · utility
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17References
14Claims
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Key dates
| Filing date | Mar 15, 2018 |
| Grant date | Jan 18, 2022 |
| Priority date | — |
| Expiry date | Mar 15, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2467/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of forming a skin-foam-substrate type structure particular suitable as an automobile trim component. The method comprises supplying a polymer resin containing a chemical foaming agent and including metal particles capable of inductive heating, that is positioned between a polymeric skin and substrate, followed by inductive heating to cause foaming of the polymeric resin. The foamed polymer resin adheres to the skin and substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.