Bonded article of thin glass on support substrate, preparation method and use thereof
US11225057B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2015 |
| Grant date | Jan 18, 2022 |
| Priority date | — |
| Expiry date | Dec 27, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2457/206
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for making a bonded article, wherein a thin glass substrate is bonded on a support substrate in the absence of any interlayer by an electrostatic adhesion process with the assistance of external pressure, the pressure is applied constantly or stepwise during the adhesion process by use of a tool such as a roll or a wheel or other movable device with curved surface. The bonded article has no defects, e.g. bubbles or inclusions, in the bonded interface, which benefits transportation of the thin glass substrate and its post-processing as well. Such defect-free bonded article is also disclosed. Pressure supported electrostatic adhesion, initiated by electrostatic charges adhesion of a two members, e.g. a substrate member and a support member, is enabled to minimize, prevent and exclude defects, distortion between the adhered surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.