Fluidic dies with beveled edges underneath electrical leads
US11225070B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2018 |
| Grant date | Jan 18, 2022 |
| Priority date | — |
| Expiry date | Jan 23, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/17526
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
In one example in accordance with the present disclosure, a fluidic die is described. The fluidic die includes a surface on which a number of nozzles are formed. An electrical interface on the fluidic die establishes an electrical connection between the fluidic die and a fluidic die controller. The electrical interface includes 1) a bond pad disposed within a bond pad region of the surface and 2) an electrical lead coupled to the bend pad to establish an electrical connection between the fluidic die and the fluidic die controller. The fluidic die also includes a beveled edge along an edge of the surface underneath the electrical lead.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.