Local connection device with controlled separation comprising a multidirectional bonding layer
US11225340B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2019 |
| Grant date | Jan 18, 2022 |
| Priority date | — |
| Expiry date | Apr 10, 2040 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF42B15/38
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
To enable a local connection with separation on command, a connection device (20) comprises a first base plate (24), a first connection wall (22) forming a protuberance from the first base plate (24) and having an internal surface (22A) delimiting an internal volume (V) located on the side of the first base plate, on a first side, and a first connection surface (22B), a second base plate (28), a second connection wall (26) fixed to the second base plate on a second side and with a second connection surface (26A) covering the first connection wall (22) so as to form a space (S) between the first and second connection surfaces, a bonding layer (30) arranged in the space and extending along at least two distinct directions, and a heat generating material (32) arranged in an internal volume so as to enable heating of the bonding layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.