Method and system for measuring strain in a 3D printed part
US11226195B1 · kind B1 · utility
1Cited by
3References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 2019 |
| Grant date | Jan 18, 2022 |
| Priority date | — |
| Expiry date | May 7, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/66
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and system for measuring strain in a 3D printed part is disclosed herein. The printed part can be formed with internal features that can be analyzed with a digital image correlation system to determine strain levels in internal regions of the part. The features are visually identifiable due to a different color, shape, design or other visually distinguishable characteristics relative to that of the base structural material. The features can be the formed from the same material or a different material from that of the base structure material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.