Camera modules having integrated time of flight sensors
US11226415B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2020 |
| Grant date | Jan 18, 2022 |
| Priority date | — |
| Expiry date | Sep 14, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/56
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Systems, methods, and computer-readable media are disclosed for camera modules having integrated time of flight sensors. In one embodiment, an integrated sensor module may include a substrate, a molding compound disposed on the substrate, and a camera sensor disposed on the substrate. The integrated sensor module may include a vertical-cavity surface-emitting laser assembly (VCSEL) disposed on the molding compound and separated from the substrate by a first distance, and a single photon avalanche photodiode assembly (SPAD) disposed on the molding compound and separated from the substrate by the first distance. The camera sensor may be configured to detect a first portion of light emitted by the VCSEL and reflected from an object, and the SPAD may be configured to detect a second portion of light emitted by the VCSEL and reflected from the object.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.