Integrated photonics device having integrated edge outcouplers
US11226459B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Feb 13, 2019 |
| Grant date | Jan 18, 2022 |
| Priority date | — |
| Expiry date | Feb 13, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12178
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Described herein is an integrated photonics device including a light emitter, integrated edge outcoupler(s), optics, and a detector array. The device can include a hermetically sealed enclosure. The hermetic seal can reduce the amount of moisture and/or contamination that may affect the measurement, analysis, and/or the function of the individual components within the sealed enclosure. Additionally or alternatively, the hermetic seal can be used to protect the components within the enclosure from environmental contamination induced during the manufacturing, packaging, and/or shipping process. The outcoupler(s) can be formed by creating one or more pockets in the layers of a die. Outcoupler material can be formed in the pocket and, optionally, subsequent layers can be deposited on top. The edge of the die can be polished until a targeted polish plane is achieved. Once the outcoupler is formed, the die can be flipped over and other components can be formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.