Positive-type photosensitive resin composition and cured film prepared therefrom
US11226558B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2019 |
| Grant date | Jan 18, 2022 |
| Priority date | — |
| Expiry date | Mar 12, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/039
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The composition comprises a photopolymerizable compound containing a double bond and a specific photopolymerization initiator, wherein the photopolymerizable compound containing a double bond suppresses the photopolymerization reaction upon exposure to light but causes the photopolymerization reaction at the time of photobleaching after development, thereby controlling the flowability of the composition during thermal curing. Thus, a pattern is readily formed, which makes it possible to maintain excellent sensitivity upon the development and even upon the hard-bake process after the development, and it is possible to provide a cured film that is excellent in film strength and film retention rate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.