Transfer support and transfer module
US11227787B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 3, 2018 |
| Grant date | Jan 18, 2022 |
| Priority date | — |
| Expiry date | Jun 2, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68368
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A transfer support adapted to contact a plurality of elements is provided. The transfer support has a first surface, a second surface opposite to the first surface, a recess located on the second surface, a plurality of platforms protruded from the first surface, a plurality of supporting pillars distributed in the recess and a plurality of through holes. The platforms have carry surfaces adapted to contact the plurality of elements. The through holes extend from the carry surfaces of the platforms to the recess, and two of the adjacent supporting pillars are spaced apart from each other to form an air passage. In addition, a transfer module is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.