Heat radiating member and electrical junction box
US11227811B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2019 |
| Grant date | Jan 18, 2022 |
| Priority date | — |
| Expiry date | Dec 14, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16227
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat radiating member and an electrical junction box are provided that have a simple configuration and are capable of quickly radiating heat generated by a semiconductor device. A support member, which receives heat from a substrate portion having a mounting face on which a semiconductor device is mounted, via an opposing plate portion opposing the mounting face, and radiates the received heat, includes a recessed portion formed in the opposing plate portion, at a position corresponding to the semiconductor device. The recessed portion has a wall thickness that is greater than that of another portion of the opposing plate portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.