Semiconductor device and method for manufacturing the same
US11227850B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 22, 2020 |
| Grant date | Jan 18, 2022 |
| Priority date | — |
| Expiry date | Jul 28, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/171
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method includes: providing a package body including a mounting part having a chip mounting region for mounting a semiconductor chip, a side wall part having a first sealing surface continuously provided over an entire perimeter of the mounting part, surrounding the chip mounting region and provided on the mounting part, a first recess provided on the first sealing surface, and a first solder outflow prevention part continuously provided on the first sealing surface and positioned closer to the chip mounting region side than the first recess; providing a cap having a second sealing surface facing the first sealing surface; providing a ball solder made of an alloy of gold and tin as principal ingredients; placing the ball solder in the first recess; placing the cap on the ball solder; and melting once and then solidifying the ball solder to bond the first sealing surface and the second sealing surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.