Method of manufacturing an LED carrier assembly having an embedded alignment magnet
US11227853B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2017 |
| Grant date | Jan 18, 2022 |
| Priority date | — |
| Expiry date | Nov 30, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention describes a method of manufacturing an LED carrier assembly, which method comprises the steps of providing a carrier comprising a mounting surface with mounting pads arranged to receive a number of LED dies; embedding an alignment magnet in the carrier; providing a number of LED dies, wherein an LED die comprises a number of magnetic die pads; and aligning the magnetic die pads to the mounting pads by arranging the LED dies over the mounting surface of the carrier within magnetic range of the alignment magnet. The invention also describes an LED carrier assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.