Semiconductor structure having a bridge layer
US11227975B2 · kind B2 · utility
0Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2019 |
| Grant date | Jan 18, 2022 |
| Priority date | — |
| Expiry date | Aug 23, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/819
Abstract
A semiconductor structure includes a carrier having a surface, a supporting element, a semiconductor stack and a bridge layer. The supporting element is on the surface. The semiconductor stack is on the surface and has a side surface. The bridge layer includes a first portion connecting to the supporting element, a second portion, and a third portion connecting to the semiconductor stack. The second portion is extended from the third portion toward the first portion and is protruded from the side surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.