Heat dissipation structure and heat dissipation method
US11229114B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 12, 2018 |
| Grant date | Jan 18, 2022 |
| Priority date | — |
| Expiry date | Dec 12, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10409
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This heat dissipation structure includes: a circuit board; an integrated circuit mounted thereon; a first thermal pad disposed on the surface of the integrated circuit; a heat sink having a first surface that applies pressure to the first thermal pad by sandwiching the first thermal pad together with the surface of the integrated circuit and a second surface facing the first surface; a second thermal pad disposed on the second surface; a heat dissipation casing having a surface that applies pressure to the second thermal pad by sandwiching the second thermal pad together with the second surface; and stud components for pulling up the heat sink from the heat dissipation casing side together with the circuit board such that the second thermal pad is sandwiched and pressurized between the heat dissipation casing and the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.