Heat dissipation housing, manufacturing method thereof and electronic device using the same
US11229144B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2020 |
| Grant date | Jan 18, 2022 |
| Priority date | — |
| Expiry date | Jun 12, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0203
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipation housing includes an outer casing and the heat conduction block. The heat dissipation housing includes a thickness portion and at least one first tenon extending towards the inner direction of the outer casing from the inner surface of the thickness portion. Heat conduction block includes a base and at least one second tenon extending towards the outer direction of the outer casing from the base. The first tenon and the second tenon are combined, such that the first tenon, the second tenon, and the base together form a column extending towards the inner direction of the outer casing from the inner surface of the thickness portion. The outer casing and the heat conduction block both have a thermal conductivity greater than 0.5 W/m-k.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.