Method for monitoring quality of hot stamped components
US11229935B2 · kind B2 · utility
1Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2016 |
| Grant date | Jan 25, 2022 |
| Priority date | — |
| Expiry date | Mar 6, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC21D11/005
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A hot stamping system includes a controller programmed to alter a coolant flow rate, without altering cycle time, in an active cooling system of a die arrangement, configured to hot stamp metal into components, based on an amount of heat transferred from the components to the active cooling system such that a grain structure of the components transitions from an austenitic state to a martensitic state while the die arrangement is closed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.