Machines for the separative machining of plate-shaped workpieces

US11229980B2 · kind B2 · utility

Assignee

• TRUMPF Werkzeugmaschinen GmbH + Co. KG · DE

Inventors

• Magnus Deiss · Stuttgart, DE
• Peter Epperlein · Ditzingen, DE
• Simon Ockenfuss · Eppelheim, DE
• Frank Schmauder · Metzingen, DE
• Dennis Wolf · Westlake, US

Key dates

• Filing date: Jun 20, 2016
• Grant date: Jan 25, 2022
• Expiry date: Apr 10, 2037

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B26F1/3813
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

The invention relates to machines and methods for separative machining of plate-shaped workpieces by a processing beam. The machines include a first movement unit configured to move the workpiece in a first direction and a second movement unit including a machining head configured to emit the processing beam. The second movement unit is configured to move the machining head in a second direction perpendicular to the first direction to direct the processing beam onto the workpiece. The machines include a first workpiece support unit including a first workpiece-bearing face and a second workpiece support unit including a second workpiece-bearing face spaced apart by a gap from the first workpiece support unit and the first workpiece-bearing face. The gap extends along the second direction. The machines include at least one support slide arranged to move in the second direction within the gap and including a support slide bearing face.