Films for use as interleaves between substrates
US11230417B2 · kind B2 · utility
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4References
16Claims
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Assignee
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Key dates
| Filing date | Jan 21, 2020 |
| Grant date | Jan 25, 2022 |
| Priority date | — |
| Expiry date | Jan 21, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2571/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A film for use as an interleaf between substrates includes a first side having a first micro-embossed surface and a first formed pattern, a second side having a second micro-embossed surface and a second formed pattern, a basis weight of between about 35 gsm and about 80 gsm, a Low Load Thickness of between about 150 micrometers and 400 micrometers according to the Low Load Thickness Test, and a flexural stiffness of between about 150 grams and about 500 grams according to the Circular Bend Stiffness Test.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.