Adhesive film and a flat wiring member using the same
US11230651B2 · kind B2 · utility
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12Claims
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Key dates
| Filing date | Nov 7, 2017 |
| Grant date | Jan 25, 2022 |
| Priority date | — |
| Expiry date | Dec 1, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2479/086
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An adhesive film includes a resin film; and an adhesive layer provided on the resin film. The adhesive layer includes a resin composition including 2 parts by mass or more of an epoxy resin including two or more epoxy groups in molecules and having epoxy equivalents of 300 g/eq or less, per 100 parts by mass of an amorphous resin, which is soluble to a solvent and has a plurality of carboxyl groups in molecules, and which has a glass transition temperature of 100° C. or less and an acid value of 5 KOHmg/g or more. A flat wiring member includes a conductor and the adhesive film as described above.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.