Sensor chip
US11231445B2 · kind B2 · utility
Assignees
Inventor
Key dates
| Filing date | Jul 22, 2019 |
| Grant date | Jan 25, 2022 |
| Priority date | — |
| Expiry date | Jul 21, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/1003
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Provided is a sensor chip including: a board; a three-dimensional object provided on the board, the three-dimensional object being a cuboid or a cube having a first surface and a second surface facing the first surface and including an insulating material; a first coil provided on the first surface; a second coil provided on the second surface, the second coil being electrically connected to the first coil; and a magnetic measurement element provided in the three-dimensional object. Directions of magnetic fields generated in the first coil and the second coil by current for electrically conducting the first coil and the second coil are the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.