Integrated photonic device with improved optical coupling
US11231548B2 · kind B2 · utility
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12Claims
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Key dates
| Filing date | Apr 13, 2020 |
| Grant date | Jan 25, 2022 |
| Priority date | — |
| Expiry date | Apr 13, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12147
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A three-dimensional photonic integrated structure includes a first semiconductor substrate and a second semiconductor substrate. The first substrate incorporates a first waveguide and the second semiconductor substrate incorporates a second waveguide. An intermediate region located between the two substrates is formed by a one dielectric layer. The second substrate further includes an optical coupler configured for receiving a light signal. The first substrate and dielectric layer form a reflective element located below and opposite the grating coupler in order to reflect at least one part of the light signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.