Heat transfer through frame component of head-mounted device
US11231590B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2020 |
| Grant date | Jan 25, 2022 |
| Priority date | — |
| Expiry date | Sep 30, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus includes a frame component of a head-mounted device (HMD), an eyepiece, a battery, a processor, a heat pipe, and a hinge. The frame component includes a first compartment, a second compartment, and a channel connecting the first compartment and the second compartment. The heat pipe may extend from the first compartment to the second compartment through a channel and may be configured to transfer heat from the processor to the battery. A rate of heat transfer through the hinge may be greater than a threshold value when the hinge is in an open conformation that configures the frame component to be positioned along the side of the head. The heat transfer through the hinge may be smaller than the threshold value when the hinge is in a folded conformation that configures the frame component to be positioned for storage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.