Patent · US Active

Thermal dissipation in dual-chassis devices

US11231757B2 · kind B2 · utility

2Cited by

2References

18Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Prakash Kurma Raju · Bengaluru, IN
Babu Triplicane Gopikrishnan · Kanchinakote, IN
Bijendra Singh · Bengaluru, IN
Prasanna Pichumani · Kanchinakote, IN
Raghavendra Doddi · Bengaluru, IN
Harish Jagadish · Kanchinakote, IN
Gopinath Kandasamy · Bengaluru, IN
David Pidwerbecki · Corvallis, US

Key dates

Filing date	Aug 1, 2018
Grant date	Jan 25, 2022
Priority date	—
Expiry date	Aug 1, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH04M2250/16
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.