Ex-situ manufacture of metal micro-wires and FIB placement in IC circuits
US11233017B2 · kind B2 · utility
0Cited by
0References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 3, 2019 |
| Grant date | Jan 25, 2022 |
| Priority date | — |
| Expiry date | Oct 20, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q9/42
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package includes a first conductive element that is fabricated as part of the integrated circuit package and a micro-wire having a first end coupled to the first conductive element. The micro-wire has been fabricated ex-situ and is of a metal having a diameter of 10 microns or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.