Semiconductor device
US11233171B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2019 |
| Grant date | Jan 25, 2022 |
| Priority date | — |
| Expiry date | Apr 8, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/824
Abstract
The present disclosure provides a semiconductor device which includes a base layer and a buffer structure. The base layer includes a first semiconductor compound having a first lattice constant and including a plurality of elements, and an atomic radius of one of the plurality of elements which has the largest atomic radius is defined as a first atomic radius. The buffer structure includes a second semiconductor compound and a first additive. The second semiconductor compound has a second lattice constant and the first additive has a second atomic radius. The second lattice constant is larger than the first lattice constant, and the second atomic radius is larger than the first atomic radius.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.