Light-emitting device and method for manufacturing the same
US11233184B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2020 |
| Grant date | Jan 25, 2022 |
| Priority date | — |
| Expiry date | Mar 31, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/853
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light-emitting device includes: a light-emitting element; a base including a first lead having an element disposal portion and a first wire bonding portion, a second lead having a second wire bonding portion and a fixing member; a frame provided on a upper surface of the base; an Ag plating layer covering an upper surface of the element disposal portion; an Au plating layer covering at least an upper surface of the first wire bonding portion and at least an upper surface of the second wire bonding portion; a first wire; and a second wire. The Ag plating layer is disposed apart inwardly from at least a part of an outer circumference of an end portion of the element disposal portion, and the frame body is provided at a position that the frame body covers the Ag plating layer, the first wire bonding portion, and the second wire bonding portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.