Patent · US Active

Monitoring material soldification byproducts during additive manufacturing

US11235392B2 · kind B2 · utility

0Cited by
11References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 22, 2015
Grant dateFeb 1, 2022
Priority date
Expiry dateSep 23, 2036

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P10/25
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

A system is provided for additively manufacturing a part. This additive manufacturing system includes a base, a solidification device and a detection device. The base is adapted to support material; e.g., powder material. The solidification device is adapted to solidify at least a portion of the supported material to form at least a portion of the part. The detection device is adapted to detect emissions produced by the solidification of at least a portion of the material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.