Monitoring material soldification byproducts during additive manufacturing
US11235392B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2015 |
| Grant date | Feb 1, 2022 |
| Priority date | — |
| Expiry date | Sep 23, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A system is provided for additively manufacturing a part. This additive manufacturing system includes a base, a solidification device and a detection device. The base is adapted to support material; e.g., powder material. The solidification device is adapted to solidify at least a portion of the supported material to form at least a portion of the part. The detection device is adapted to detect emissions produced by the solidification of at least a portion of the material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.