Patent · US Active

Curing agent composition for an epoxy resin compound, epoxy resin compound and multi-component epoxy resin system

US11236194B2 · kind B2 · utility

0Cited by

1References

17Claims

0Family size

Assignee

Hilti Aktiengesellschaft · LI

Inventors

Nicole Behrens · Phoenix, US
Alexander Bornschlegl · Munich, DE
Ursula Pachmayr · Kaufering, DE
Cornelia Wiesmeier · Fürstenfeldbruck, DE
Jeremia Pillar · Landsberg am Lech, DE

Key dates

Filing date	Sep 9, 2019
Grant date	Feb 1, 2022
Priority date	—
Expiry date	Sep 9, 2039

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08K5/5419
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

The invention relates to a curing agent composition for an epoxy resin compound for the chemical fastening of construction elements, to an epoxy resin compound, and to a multi-component epoxy resin system. The invention further relates to a method for the chemical fastening of construction elements in boreholes. The invention also relates to the use of a salt (S) as an accelerator in an epoxy resin compound for chemical fastening, the epoxy resin compound comprising 3-aminomethyl-3,5,5-trimethylcyclohexane and at least one further cycloaliphatic amine which is reactive to epoxy groups.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.