Patent · US Active

Method of manufacturing a conductive pattern

US11236249B2 · kind B2 · utility

0Cited by

1References

16Claims

0Family size

Assignee

Agfa-Gevaert NV · BE

Inventors

Fernando Cortes Salazar · Mortsel, BE
Koen Steert · Mortsel, BE
Vincent Courtet · Mortsel, BE
Karl Van Den Bossche · Mortsel, BE
Willem Gilbert · Mortsel, BE
Gert Daelemans · Mortsel, BE
Peter Willaert · Mortsel, BE

Key dates

Filing date	Jun 7, 2018
Grant date	Feb 1, 2022
Priority date	—
Expiry date	Jun 7, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/125
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

A method of preparing a conductive pattern on a substrate includes the steps of applying a receiving layer on a substrate, applying a metallic nanoparticle dispersion on the white receiving layer thereby forming a metallic pattern, and sintering the metallic pattern, characterized in that the receiving layer has a roughness Rz between 1 and 75.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.