Comolded non-destructive inspection standard functioning as a bond bump
US11237133B2 · kind B2 · utility
0Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2019 |
| Grant date | Feb 1, 2022 |
| Priority date | — |
| Expiry date | Apr 3, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/2693
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An inspection feature for an adhesive bond portion between parts of a component comprising the inspection feature extending from a surface of the part of the component a predetermined bond line thickness, the inspection feature having a density configured to imitate a defect of the adhesive bond portion responsive to a non-destructive inspection scan.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.