Array substrate, method of manufacturing array substrate, display panel and display apparatus
US11237657B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 19, 2020 |
| Grant date | Feb 1, 2022 |
| Priority date | — |
| Expiry date | Mar 19, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04103
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Embodiments of the present disclosure provide an array substrate, a method of manufacturing the array substrate, a display panel and a display apparatus. The array substrate includes: a substrate; a touch pad disposed on a side of the substrate; a first planarization layer disposed on a side of the touch pad facing away from the substrate; a first passivation layer disposed on a side of the first planarization layer facing away from the touch pad; a touch electrode layer disposed on a side of the first passivation layer facing away from the first planarization layer; and a first via hole sequentially passing through at least the first planarization layer and the first passivation layer. The touch electrode layer is electrically connected to the touch pad through the first via hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.