Semiconductor module, semiconductor device, and vehicle
US11239123B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2013 |
| Grant date | Feb 1, 2022 |
| Priority date | — |
| Expiry date | Oct 6, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T10/70
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A base plate (1) includes a fixed surface and a radiating surface which is a surface opposite to the fixed surface. An insulating substrate (3) is bonded to the fixed surface of the base plate (1). Conductive patterns (4,5) are provided on the insulating substrate (3). Semiconductor chips (7,8) are bonded to the conductive pattern (4). An Al wire (12) connects top surfaces of the semiconductor chip (8) to the conductive pattern (5). The insulating substrate (3), the conductive patterns (4 ,5), the semiconductor chips (7 to 10) and the Al wires (11 to 13) are sealed with resin (16). The base plate (1) includes a metal part (19) and a reinforcing member (20) provided in the metal part (19). A Young's modulus of the reinforcing member (20) is higher than a Youngs modulus of the metal part (19).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.